ISAS 2019:Editor's Preface

This volume contains the selected papers presented at ISAS 2019: International Symposium on Applied Science 2019 held on October 18-19, 2019 in Ho Chi Minh City, Vietnam.


There were 196 submissions. Each submission was reviewed by at least 02, and on the average 2.1, reviewers in the peer-review process. The committee decided to accept 176 papers to present in the symposium. The program also includes 06 invited papers. In this volume, 39 papers were selected to publish.


The International Symposium on Applied Science (ISAS), formerly was International Symposium on Engineering Physics and Mechanics (ISEPM) has been held every two years since 2011, aims to bring together researchers from different countries and to promote a synergy collaborated research with the creation and exchange of ideas related to the applied science field.


The symposium program focuses on both fundamental and applied researches in areas related to the applied science field. ISAS 2019 will cover aspects not only the engineering physics and engineering mechanics field but also applied mathematics, computational physics, and innovative technologies. We will strive hard to create a platform of collaborations and meetings where all the scientists, academicians, lab experts, industry people, and young researchers will meet at one place to share and gain knowledge through panel discussions, technical-scientific sessions, workshops, and poster presentations.


This year, with the theme of “Connecting Global Knowledge and Understanding in Applied Science” and under the auspice of National Office of Intellectual Property of Vietnam and Kyushu Institute of Technology (Kyutech-Japan), we have 196 submissions, 176 accepted paper (89.79%) to present in the symposium. 315 authors from 64 affiliations/universities of 16 countries are contributed to the symposium.


Along with sharing and gaining knowledge, the symposium also provides space for interactions where everyone will be given the freedom to interact and helps in making new international collaborations. The symposium will also provide the best opportunity to delegates and people from industry to make new contacts where they can develop their product. In this regard, on behalf of the Organizing Committee, we warmly welcome all participants to join us and make the symposium a successful one. Please peruse this book for useful information. We are looking forward to developing with you in-depth collaborations.


On behalf of the organizer, we would like to express our gratitude for Vietnam National University Ho Chi Minh City, Ho Chi Minh City University of Technology, National Office of Intellectual Property of Vietnam, and Kyushu Institute of Technology (Kyutech-Japan), iMed Medical Equipment Co., Ltd, Archmediz Co., Ltd, and VBS Tech Co., Ltd for their generous sponsorship and support for ISAS 2019.


We would also like to express our gratitude for EasyChair and their staff for their generous support. Without their support, the ISAS 2019 could not achieve in successful.

Tich Thien Truong
Trung Nghia Tran
Quoc Khai Le
Thanh Nha Nguyen
April 20, 2020
Ho Chi Minh City, Vietnam